EskeRahn 5,464 Posted April 27, 2019 Share Posted April 27, 2019 They twitted this small video But can anyone tell me what we are actually seeing? What is applied in the first part? And what is the last? Cooling? Nice to see it's moving ahead non the less. :) Quote Link to post Share on other sites
CornholioGSM 339 Posted April 27, 2019 Share Posted April 27, 2019 i mean that it is soft conductive material...it is used on many phones for made conductive contact between mainboard ground and phone frame. It is for better shielding of phone Quote Link to post Share on other sites
Noir 112 Posted April 30, 2019 Share Posted April 30, 2019 First process, as CornholioGSM mentioned, is adding some kind of 'cushion', these are the edges where the PCB will be installed, if there are sharp edges it might damage the PCB, that is why this soft material is applied. Second process is a QC of the part, to check if the surface of the corners and the frame is smooth and even. Great to get this documented by FxTec. :) Quote Link to post Share on other sites
EskeRahn 5,464 Posted April 30, 2019 Author Share Posted April 30, 2019 Second process is a QC of the part, to check if the surface of the corners and the frame is smooth and even. Ah of course, now I get it!. Thanks! They are trying to probe with a very thin blade if it can glide under. Quote Link to post Share on other sites
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